From my 2023 PhD thesis, step-by-step guide on packaging silicon photonic integrated circuits from an academic perspective.
Co-authors:
Simon Bilodeau @simbilod
Thomas Ferreira de Lima @thomaslima
Prof. Paul R. Prucnal
Please feel free to update and contribute as these techniques evolve.
View Photonic Packaging Manual
Source: Blow, Eric Charles. Microwave Photonic Interference Cancellation: RF Analysis, III-V and Silicon Integration, Development of Balanced and Hybrid Architectures. Diss. Princeton University, 2024.
References:
[1] L. Ranno, P. Gupta, K. Gradkowski, R. Bernson, D. Weninger, S. Serna, A. M. Agarwal, L. C. Kimerling, J. Hu, and P. OBrien, “Integrated photonics packaging: Challenges and opportunities,” ACS Photonics, vol. 9, no. 11, pp. 3467–3485, 2022.
[2] L. Zimmermann, G.B.Preve, T.Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics—a review of the epixpack photonics packaging platform,” IEEE Journal of Selected Topics in Quantum Electronics, vol. 17, no. 3, pp. 645–651, 2010.
[3] W. Heinrich, M. Hossain, S. Sinha, F.-J. Schm¨ uckle, R. Doerner, V. Krozer, and N. Weimann, “Connecting chips with more than 100 ghz bandwidth,” IEEE Journal of Microwaves, vol. 1, no. 1, pp. 364–373, 2021.
[4] A. Hassona, Z. S. He, V. Vassilev, C. Mariotti, S. E. Gunnarsson, F. Dielacher, and H. Zirath, “Demonstration of+ 100-ghz interconnects in ewlb packaging technology,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 7, pp. 1406–1414, 2019.
[5] T. Ferrier de Lima, “Neuromorphic computing with silicon photonics,” Princeton University, 2022.
[6] I. P. Borovinskaya, “Tantalum nitride,” Concise Encyclopedia of Self-Propagating HighTemperature Synthesis, pp. 370–371, 2017. 34
[7] T. Akashi, “Fabrication of a tantalum-nitride thin-film resistor with a low-variability resistance,” IEEJ Transactions on Sensors and Micromachines, vol. 125, no. 4, pp. 182–187, 2005.