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Description
This is NOT a priority. Please only fix after more critical issues are resolved.
The supplier country and company charts are not aligned for the following nodes: film, stack, and shape metrology tools, assembly inspection tools, bonding tools, die attaching tools, Die attaching tools for IC, Die attaching tools for non-IC, Other interconnect tools, Wire bonding tools, Auto ball bonders for IC, Auto ball bonders for non-IC, Automatic wedge bonders, Dicing tools, Fabrication tools (for advanced packaging), Deposition tools (adv. pkg.), ECP tools (adv. pkg.), PVD tools (adv. pkg.), Etch and clean tools (adv. pkg.), Single wafer spin & spray systems (adv. pkg.), Packaging tools, Handlers and probers, Test tools, Burn-in test tools, Linear and discrete testing tools, Memory test tools, SoC test tools